Caracteristicas y Especificaciones de:

Kingston DDR3 8Gb 1600MHz HyperX New Genesis Gris 2X4G CL9 Intel XMP

Modelo: KHX1600C9D3X2K2/8GX

Kingston HyperX is P67 compatible
HyperX® is the choice of gamers, enthusiasts and professionals who want high speeds and high performance. Now HyperX is ready for the P67 revolution and supports the new P67 motherboards on the market. When you choose Kingston® HyperX, rest assured you’re getting the highest quality memory, backed by 100-percent testing, a lifetime warranty and legendary Kingston reliability.

Compatible Motherboards

Intel
 DP67BG

Asus
 Maximus IV Extreme
 Sabertooth P67
 P8P67 Deluxe**
 P8P67 Pro     

Gigabyte
 GA-P67A-UD7
 GA-P67A-UD5
 GA-P67A-UD4P**
 GA-P67A-UD3P

MSI
 P67A-GD65
 P67A-GD55

KHX1600C9D3X2K2/8GX
8GB (4GB 512M x 64-Bit x 2 pcs.) DDR3-1600MHz
CL9 240-Pin DIMM Kit

DESCRIPTION:
Kingston's KHX1600C9D3X2K2/8GX is a kit of two 512M x 64-bit (4GB) DDR3-1600MHz CL9 SDRAM (Synchronous
DRAM) memory modules, based on sixteen 256M x 8-bit DDR3 FBGA components per module. Each module kit supports
Intel® XMP (Extreme Memory Profiles). Total kit capacity is 8GB. Each module kit has been tested to run at DDR3-
1600MHz at a low latency timing of 9-9-9-27 at 1.65V. The SPDs are programmed to JEDEC standard latency DDR3-
1333MHz timing of 9-9-9 at 1.5V. Each 240-pin DIMM uses gold contact fingers and requires +1.5V. The JEDEC standard
electrical and mechanical specifications are as follows:

FEATURES:
JEDEC standard 1.5V ± 0.075V Power Supply
VDDQ = 1.5V ± 0.075V
667MHz fCK for 1333Mb/sec/pin
8 independent internal bank
Programmable CAS Latency: 5,6,7,8,9,10
Posted CAS
Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
Programmable CAS Write Latency(CWL) = 7 (DDR3-1333)
8-bit pre-fetch
Burst Length: 8 (Interleave without any limit, sequential with starting address “000” only), 4 with tCCD = 4
which does not allow seamless read or write [either on the fly using A12 or MRS]
Bi-directional Differential Data Strobe
Internal(self) calibration : Internal self calibration through ZQ pin (RZQ : 240 ohm ± 1%)
On Die Termination using ODT pin
Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°C
Asynchronous Reset
PCB : Height 1.180” (30.00mm), double sided component

PERFORMANCE:
CL(IDD) 9 cycles
Row Cycle Time (tRCmin) 49.5ns (min.)
Refresh to Active/Refresh Command Time (tRFCmin) 160ns
Row Active Time (tRASmin) 36ns (min.)
Power 2.225 W (operating per module)
UL Rating 94 V - 0
Operating Temperature 0o C to 85o C
Storage Temperature -55o C to +100o C